OXYstrip TS-7240 is an ammonium bifluoride/hydrogen peroxide based tin/solder stripper. OXYstrip TS-7240 can be used in spray or immersion and for either full panel or tab stripping applications. OXYstrip TS-7240 is excellent for selective solder stripping applications where nickel/gold plating is present because it will not attack the nickel plating and cause gold slivers. OXYstrip TS-7240 strips tin/solder quickly and leaves the underlying copper surface clean, residue free and ready for subsequent processing. OXYstrip TS-7240 can be replenished with OXYstrip TS-7250 stabilized peroxide to extend bath life.
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NITROstrip NS-7117 strips tin and solder etch resists quickly and cleanly and leaves the underlying copper surface with a bright, uniform finish. NITROstrip NS-7117’s concentrated formulation allows the user to maintain fast strip rates with very high metal loading. Proprietary additives minimize copper attack and minimize sludge formation. NITROstrip NS-7117 can also be used to strip HAL solder when reworking is required. Use NITROstrip NS-7117 in batch or continuous replenishmentapplications.